Exascale Labs and Compal Partner for AI Infrastructure

San Francisco, USA and Taipei, Taiwan, May 19, 2026 - Exascale Labs Inc. and Compal Electronics, Inc. (TWSE: 2324), a global leader in IT solutions, have announced a strategic partnership to present a fully integrated AI infrastructure solution at the upcoming COMPUTEX Taipei 2026 event. The joint exhibition, themed 'AI Together', will demonstrate a complete, deployment-ready AI data center stack.

The partnership combines Compal's advanced hardware capabilities with Exascale's modular infrastructure design. The integrated solution spans four critical layers of AI data center operations, ranging from compute and cooling to specialized infrastructure and power delivery systems. This collaboration aims to address the rapidly increasing thermal and power density requirements of modern artificial intelligence workloads.

• Key Highlights of the Integrated Solution:
• Compute: Compal will present its latest AI server platforms, including the OG231-2-L1, OG430-2-L1, and SGX30-2 systems, optimized for training and inference.
• Cooling: Compal's Direct Liquid Cooling (DLC) technology will be showcased to manage heat at the rack-level for high-power GPUs.
• Infrastructure: Exascale will feature its Modular Data Center (MDC), which pre-integrates power, cooling, and networking within a containerized, factory-built format.
• Power: Exascale will demonstrate its HVDC/800 V DC power architecture utilizing Solid-State Transformers (SST) to streamline power paths and improve electrical efficiency.

The solution will be on display at Compal's booth (M0804) during the COMPUTEX event from June 2 to June 5, 2026. Representatives from both companies will be available to discuss how these integrated technologies facilitate rapid AI capacity deployment for enterprise and industrial partners.